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Dongguan Ziitek Electronical Material and Technology Ltd.
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Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

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Product Details
Brand Name: Ziitek
Model Number: TIE380-45
Certification: RoHS
Place of Origin: China
Minimum Order: 5kg
Payment Terms: T/T
Delivery Time: 3-8 work days
Packaging Details: 1kg/can
Products name: Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
Feature: heat cured epoxy adhesive
Usage: bonding two parts of electronics
Hardness: 92 Shore A
Chemical type: epoxy
Keywords: Thermal Epoxy Glue
Thermal conductivity: 4.5W/m-K
Description
4.5W/mK thermal conductivity heat cured epoxy adhesive for bonding two parts of electronics Product Summary: TIE™380-45 is a one component, heat cured ...

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